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1. product pro?le 1.1 general description high-voltage switching diodes, encapsulated in a very small surface-mounted device (smd) plastic package. 1.2 features 1.3 applications 1.4 quick reference data [1] single diode loaded. [2] when switched from i f = 10 ma to i r = 10 ma; r l = 100 w ; measured at i r = 1 ma. bas21w series high-voltage switching diodes rev. 01 9 october 2009 product data sheet table 1. product overview type number con?guration package package con?guration nxp jedec bas21w single sot323 sc-70 very small bas21aw dual common anode bas21sw dual series n high switching speed: t rr 50 ns n low capacitance: c d 2pf n low leakage current n very small smd plastic package n high reverse voltage: v r 250 v n aec-q101 quali?ed n high-speed switching n voltage clamping n general-purpose switching n reverse polarity protection table 2. quick reference data symbol parameter conditions min typ max unit per diode i f forward current [1] - - 225 ma i r reverse current v r = 200 v - - 100 na v r reverse voltage - - 250 v t rr reverse recovery time [2] --50ns
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 2 of 11 nxp semiconductors bas21w series high-voltage switching diodes 2. pinning information 3. ordering information table 3. pinning pin description simpli?ed outline graphic symbol bas21w 1 anode 2 not connected 3 cathode bas21aw 1 cathode (diode 1) 2 cathode (diode 2) 3 common anode bas21sw 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 12 3 006aaa764 3 12 12 3 006aab099 12 3 12 3 006aaa763 12 3 table 4. ordering information type number package name description version bas21w sc-70 plastic surface-mounted package; 3 leads sot323 bas21aw bas21sw
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 3 of 11 nxp semiconductors bas21w series high-voltage switching diodes 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china 5. limiting values [1] single diode loaded. [2] double diode loaded. [3] t j =25 c prior to surge. [4] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. table 5. marking codes type number marking code [1] bas21w x4* bas21aw x6* bas21sw x5* table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per diode v r reverse voltage - 250 v i f forward current [1] - 225 ma [2] - 125 ma i frm repetitive peak forward current - 625 ma i fsm non-repetitive peak forward current square wave [3] t p =1 m s-9a t p = 100 m s-3a t p =10ms - 1.7 a per device p tot total power dissipation t amb 25 c [4] - 200 mw t j junction temperature - 150 c t amb ambient temperature - 55 +150 c t stg storage temperature - 65 +150 c
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 4 of 11 nxp semiconductors bas21w series high-voltage switching diodes 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. 7. characteristics [1] when switched from i f = 10 ma to i r = 10 ma; r l = 100 w ; measured at i r = 1 ma. table 7. thermal characteristics symbol parameter conditions min typ max unit per device r th(j-a) thermal resistance from junction to ambient in free air [1] - - 625 k/w r th(j-sp) thermal resistance from junction to solder point - - 300 k/w table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v f forward voltage i f = 100 ma - - 1.0 v i f = 200 ma - - 1.25 v i r reverse current v r = 200 v - - 100 na v r = 200 v; t j = 150 c - - 100 m a c d diode capacitance f = 1 mhz; v r =0v - - 2 pf t rr reverse recovery time [1] --50ns
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 5 of 11 nxp semiconductors bas21w series high-voltage switching diodes (1) t amb = 150 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c based on square wave currents. t j =25 c; prior to surge fig 1. forward current as a function of forward voltage; typical values fig 2. non-repetitive peak forward current as a function of pulse duration; maximum values (1) t amb = 150 c (2) t amb =85 c (3) t amb =25 c (4) t amb = - 40 c fig 3. reverse current as a function of reverse voltage; typical values v f (v) 0 1.6 1.2 0.4 0.8 006aab212 200 400 600 i f (ma) 0 (1) (3) (4) (2) mbg703 10 1 10 2 i fsm (a) 10 - 1 t p ( m s) 110 4 10 3 10 10 2 006aab213 10 2 i r ( m a) v r (v) 0 250 200 100 150 50 10 1 10 - 1 10 - 2 10 - 3 10 - 4 10 - 5 (4) (1) (2) (3)
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 6 of 11 nxp semiconductors bas21w series high-voltage switching diodes 8. test information 8.1 quality information this product has been quali?ed in accordance with the automotive electronics council (aec) standard q101 - stress test quali?cation for discrete semiconductors , and is suitable for use in automotive applications. f = 1 mhz; t amb =25 c fr4 pcb, standard footprint (1) single diode loaded. (2) double diode loaded. fig 4. diode capacitance as a function of reverse voltage; typical values fig 5. forward current as a function of ambient temperature; derating curve mbg447 048 6 2 v r (v) 1.0 0.8 0.2 0.6 0.4 c d (pf) t amb ( c) 0 200 150 50 100 006aab214 100 200 300 i f (ma) 0 (2) (1) (1) i r =1ma fig 6. reverse recovery time test circuit and waveforms t rr (1) + i f t output signal t r t p t 10 % 90 % v r input signal v = v r + i f r s r s = 50 w i f d.u.t. r i = 50 w sampling oscilloscope mga881
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 7 of 11 nxp semiconductors bas21w series high-voltage switching diodes 9. package outline 10. packing information [1] for further information and the availability of packing methods, see section 14 . fig 7. package outline sot323 (sc-70) 04-11-04 dimensions in mm 0.45 0.15 1.1 0.8 2.2 1.8 2.2 2.0 1.35 1.15 1.3 0.4 0.3 0.25 0.10 12 3 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 bas21w sot323 4 mm pitch, 8 mm tape and reel -115 -135 bas21aw bas21sw
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 8 of 11 nxp semiconductors bas21w series high-voltage switching diodes 11. soldering fig 8. re?ow soldering footprint sot323 (sc-70) fig 9. wave soldering footprint sot323 (sc-70) solder lands solder resist occupied area solder paste sot323_fr 2.65 2.35 0.6 (3 ) 0.5 (3 ) 0.55 (3 ) 1.325 1.85 1.3 3 2 1 dimensions in mm sot323_fw 3.65 2.1 1.425 (3 ) 4.6 09 (2 ) 2.575 1.8 solder lands solder resist occupied area preferred transport direction during soldering dimensions in mm
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 9 of 11 nxp semiconductors bas21w series high-voltage switching diodes 12. revision history table 10. revision history document id release date data sheet status change notice supersedes bas21w_ser_1 20091009 product data sheet - -
bas21w_ser_1 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 01 9 october 2009 10 of 11 nxp semiconductors bas21w series high-voltage switching diodes 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 13.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors bas21w series high-voltage switching diodes ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 9 october 2009 document identifier: bas21w_ser_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 15. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 packing information. . . . . . . . . . . . . . . . . . . . . . 7 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 contact information. . . . . . . . . . . . . . . . . . . . . 10 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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